Carplay Box

Highlights

Quad-core Architecture

  • Cortex-A32 Dual-core:

    • Dedicated application processor

    • Up to 1.2GHz

    • Linux/FreeRTOS optional

    • Armv8-A NEON

  • Real-M300:

    • Armv8.1-M architecture (Arm® Cortex®-M55 ISA compatible)

    • Dedicated Network processor

    • Up to 333MHz

    • FPU supported

    • DSP instructions supported

    • MVE supported

  • Real-M200:

    • Armv8-M architecture (Arm® Cortex®-M23 ISA compatible)

    • Low-power Processor

    • Up to 40MHz

Storage

  • 256KB SRAM

  • DQ16 DDR2/DDR3L

  • QSPI NOR/NAND Flash

  • DQ8 DDR PSRAM

Security

  • PSA Level 1 Certified 👉

  • Armv8.1 TrustZone®/TrustZone®-M

  • TRNG

  • ECDSA/EdDSA/RSA

  • AES/SHA

  • JTAG/SWD password protection

Wireless

  • Wi-Fi6 Dual-Band

  • Wi-Fi Dolby Atmos Solution

  • Wi-Fi Card Mode 👉

  • BLE 5.3

  • BLE Mesh 1.1 Long Range

  • Dedicated RF and antenna for BT

  • LE Audio

  • Classic BT

Low Power

  • Sleep Mode:

    • WoWLAN DTIM=10: 435~470uA

    • Wi-Fi OFF: 345uA

  • Deep-Sleep: 23.1µA

More

  • display

  • MIPI-DSI interface

  • Audio

    • 5x ADC/8x DMIC

    • 2x DAC/headphone amplifier

    • 2x I2S

    • Low power VAD

  • USB 2.0: Host and Device

  • SD host: SD card/eMMC

Resources

Product Comparison

Package number

CA32

Real-M300

Real-M200

On-chip SRAM

TrustZone

NOR Flash

PSRAM

DDR

Wi-Fi

Bluetooth

Operating voltage

Operating temperature

Package (mm)

RTL8730EAH-VA3-CG

1.2GHz

333MHz

40MHz

256KB

Y

8MB

8MB

X

Wi-Fi 6 (2.4GHz + 5GHz)

BLE 5.3

2.97V ~ 3.63V

-20°C ~ 85°C

QFN100 (10 x 10)

RTL8730EAH-VD3-CG

1.2GHz

333MHz

40MHz

256KB

Y

16MB

8MB

X

Wi-Fi 6 (2.4GHz + 5GHz)

BLE 5.3

2.97V ~ 3.63V

-20°C ~ 85°C

QFN100 (10 x 10)

RTL8730EAH-VH6-CG

1.2GHz

333MHz

40MHz

256KB

Y

32MB

X

64MB (DDR2)

Wi-Fi 6 (2.4GHz + 5GHz)

BLE 5.3

2.97V ~ 3.63V

-20°C ~ 85°C

QFN100 (10 x 10)

RTL8730EAM-VA6-CG

1.2GHz

333MHz

40MHz

256KB

Y

X

X

64MB (DDR2)

Wi-Fi 6 (2.4GHz + 5GHz)

BLE 5.3

2.97V ~ 3.63V

-20°C ~ 85°C

QFN100 (10 x 10)

RTL8730ELH-VA3-CG

1.2GHz

333MHz

40MHz

256KB

Y

8MB

8MB

X

Wi-Fi 6 (2.4GHz + 5GHz)

BLE 5.3

2.97V ~ 3.63V

-20°C ~ 85°C

DR-QFN144 (11 x 11)

RTL8730ELM-VA7-CG

1.2GHz

333MHz

40MHz

256KB

Y

X

X

128MB (DDR2)

Wi-Fi 6 (2.4GHz + 5GHz)

BLE 5.3

2.97V ~ 3.63V

-20°C ~ 85°C

DR-QFN144 (11 x 11)

RTL8730ELM-VA8-CG

1.2GHz

333MHz

40MHz

256KB

Y

X

X

256MB (DDR3L)

Wi-Fi 6 (2.4GHz + 5GHz)

BLE 5.3

2.97V ~ 3.63V

-20°C ~ 85°C

DR-QFN144 (11 x 11)

Block Diagram

../_images/block_diagram_smart.svg

Core Architecture

  • Dual-Core Arm® Cortex®-A32 (AP)

    • Armv8-A architecture (ISA)

    • Up to 1.2GHz, 8-stage in-order pipeline

    • 32KB 2-way I-Cache + 32KB 4-way D-Cache

    • 256KB 8-way L2 cache

    • Arm® TrustZone® security for secure/non-secure domain isolation

  • Real-M300 (KM4, NP)

    • Armv8.1-M architecture (Arm® Cortex®-M55 ISA compatible)

    • Up to 333MHz, 3-stage pipeline

    • 16KB 4-way I-Cache + 32KB 4-way D-Cache

    • Integrated FPU/DSP/MVE extensions

    • Arm® TrustZone®-M hardware isolation

  • Real-M200 (KM0, LP)

    • Armv8-M architecture (Arm® Cortex®-M23 ISA compatible)

    • Optimized for power-critical applications

    • Up to 40MHz

    • 16KB 2-way I-Cache + 8KB 2-way D-Cache

Memory System

  • On-chip memory: 512KB SRAM

  • External memory (including KGD):

    • QSPI NOR/NAND Flash (up to 104MHz)

    • DQ8 DDR PSRAM (up to 250MHz)

    • DQ16 DDR2/DDR3L (up to 533MHz)

  • Bus architecture: Multi-layer AXI bus with parallel access

Peripherals & Interfaces

  • Flexible design of GPIO configuration

  • Multi-communication interfaces: SPI x 2, UART x 4, I2C x 3

  • Hardware IR transceiver, easy to adapt to various IR protocols

  • Supports 6 channels of general 12-bit ADC and 1 channel of VBAT

  • Audio Codec:

    • 5-channel ADC or 8-channel digital microphone (DMIC) input

    • 2-channel digital-to-analog converter (DAC) and headphone amplifier

  • Supports 6-channel PWM timer and 1 capture timer

  • Supports 9-channel touch key

  • Supports 8 independent channel GDMA

  • Supports high-speed USB 2.0 OTG

  • Supports SD host controller to access SD card and eMMC device

  • Supports 1 Real-Time Clock timer together with 12 basic timers

  • Embeds a serial LEDC to control the external LED lamps

  • Supports thermal detector to detect and monitor the real-time temperature inside the chip

  • Supports two-lane MIPI-DSI interface with D-PHY and the maximum bit rate of 1Gbps per lane

  • I2S x 2: up to 384kHz sampling rate

Security

  • Secure boot

  • TrustZone®/TrustZone®-M dual-domain isolation

  • True Random Number Generator (TRNG)

  • Hardware encryption engine (AES/SHA/ECDSA/EdDSA/RSA)

  • Flash full-disk/partition encryption

  • Read Protection (RDP) mechanism

  • JTAG/SWD interface lock

  • 2KB OTP memory (2K bits available for user)

Wireless Connectivity

  • Wi-Fi 6 (802.11ax) :

    • 802.11 a/b/g/n/ax, 1T1R, 2.4GHz/5GHz dual-band

    • MCS0-MCS9 (20 MHz bandwidth)

    • Antenna diversity, Beamforming, Target Wake Time (TWT)

    • WoWLAN

  • Bluetooth 5.3:

    • BR/EDR + BLE

    • LE Coded PHY long-range mode (125kbps/500kbps)

    • LE Audio (CIS/BIS)

    • AoA/AoD positioning

    • SIG Mesh v1.0/v1.1

    • Scatternet support

    • Dedicated antenna for Bluetooth

Power Management

  • Fine-grained clock gating, dynamic voltage/frequency scaling (DVFS)

  • Power modes: Active/Sleep/Deep-Sleep (μA-level standby)

Package and Reliability

  • QFN100 package: 10mm x 10mm

  • DR-QFN144 package: 11mm x 11mm

  • Operating voltage:

    • Standard voltage: 2.97V ~ 3.63V

  • Operating temperature:

    • Wide-range temperature: -40°C ~ 105°C

  • ESD protection: HBM ±3.5kV

Application Scenarios

  • Smart speakers

  • Industrial gateways

  • Voice-controlled appliances

  • Smart Home

  • Wearables

  • Centralized control systems